Powerchip Semiconductor Manufacturing Co., Ltd. (PSMC), SBI Holdings, Inc., Japan's Miyagi Prefecture and JSMC signed the Memorandum of Understanding (MOU, The MOU is based on the premise of receiving subsidy from Japanese government)  on the 31st, confirming that JSMC's first  fab will be selected in Japan. The Second Northern Sendai Central Industrial Park in Ohira Village, Kurokawa District, Miyagi Prefecture (Second Northern Sendai Central Industrial Park) is the planned site.

It is understood that in August this year, PSMC and SBI jointly established JSMC Co., Ltd. and began preparations for setting up a wafer fab in Japan. After extensive discussions with the municipal government of the candidate locations and multiple on-site inspections, a number of factors were taken into consideration, including: the robustness of infrastructure such as water supply, drainage, high-voltage power supply, and logistics capabilities, as well as the park’s ability to withstand natural disasters, and surrounding life. The quality of the environment and the potential for future industry-university cooperation ultimately led to the selection of the Second Northern Sendai Central Industrial Park as the site. 

PSMC said that SBI is committed to working closely with the Japanese government, Miyagi Prefecture, partners and relevant financial institutions to discuss various details of investment in Japan. More information will be announced after the details are finalized.

 

Press Spokesperson

Eric Tang, Vice President

Tel: 886-2-25170055

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Grace Yeh, Public Relations

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