Focusing on Memory and Logic Integration to Drive the Next Generation of AI High-Performance Computing

As demand for generative AI and high-performance computing (HPC) surges, memory bandwidth and power consumption constraints have become critical bottlenecks in AI chip development. Leveraging its unique advantage in possessing both Logic and Memory process technologies, Powerchip Semiconductor Manufacturing Corp. (PSMC) continues to advance its cutting-edge 3D Wafer-on-Wafer (WoW) Stacking technology to build next-generation AI chip solutions.

With the central theme of "3D AI Foundry,” PSMC is showcasing its 3D WoW DRAM stacking technology alongside key advanced packaging components such as Integrated Passive Devices (IPD/Si-Cap) and Interposers. Combined with partner companies’ IP and product design capabilities, these solutions target AI computing's critical demands for ultra-large memory capacity, high-bandwidth access, and high-stability electrical characteristics. Through this showcase, PSMC demonstrates its technical prowess and foundry service capabilities in 3D WoW stacking and advance packaging that offers a strong support behind the AI supply chain.

As AI models continue to expand, the "Memory Wall" and energy consumption challenges that traditional architectures faced are becoming increasingly severe. By integrating 3D AI DRAM with Logic chips, the data transmission path can be effectively shortened, boosting overall computing efficiency while reducing system power consumption—bringing higher performance and superior energy efficiency on AI applications.

The exhibition area also features a joint showcase with multiple ecosystem partners, including AP Memory, ESMT, Zentel Japan, Syntronix and PMD. Together, they are presenting 3D WoW stacking IP and Memory design solutions.

Furthermore, Powerchip Group partners, AeroVision Avionics, Retronicx, and A.I. Memory Corp., are concurrently demonstrating their innovative results of AI technology applied on drones, ADAS, and AI EDA (Electronic Design Automation). This further illustrates the comprehensive ecosystem layout of the "3D AI Foundry," spanning from wafers and packaging to end-user applications.