For the first time, PSMC was invited to participate in the 2022 TIE Innovation Technology Exposition. This year, the organizer set up a "Semiconductor Zone" for the first time, which became a hot spot as soon as it opened. At this exhibition, PSMC focused on "in-memory computing". AI memory architecture and 3D wafer stacking technology for AI computing performance and lower power consumption.

In response to the focus of the exhibition, PSMC specially invited Japanese partners to Taiwan to jointly demonstrate the application of IGZO (Indium Gallium Zinc Oxide)/CMOS single-chip technology in AR/VR. Through the three-dimensional monolithic integration technology, a display driver IC with a resolution higher than 3200PPi and a frame rate higher than 120Hz can be realized, which is much better than the best 2000ppi/120Hz product in the nowadays market. By integrating organic light-emitting diodes, panel drivers and logic control functions together on a single silicon wafer through system-on-chip technology, it demonstrates the advantages of low power, low noise, fast fame rate, and small chip size. It fully meets the requirements of Metaverse AR/VR development.

To further exploit the advantages of the logic and memory process technologies, PSMC also provides versatile 3D technology platforms, such as Oxide Bond, DRAM TSV-Middle, Hybrid Bond, Mini HBM, etc. Comparing with the 2.5D packaging technologies, these platforms embody the capability to significantly improve the memory bottleneck issue and to provide memory solutions for artificial intelligence, 5G edge and HPC and SoC products.

At the same time, PSMC also showcased a memory architecture dedicated to artificial intelligence at the exhibition. Artificial intelligence requires high computing power and fast memory access. The 3D Interchip stacking methodology, integrating logic chips and memory chips, provides numerous high bandwidth channels between processors and memory and shortens the data transmission distance, which significantly improve the AI ​​computing performance and greatly reduce the power consumption. PSMC is committed to the research and development and promotion of the AIM (AI Memory) architecture. At present, several customers have adopted this architecture to enter the field of high-performance computing.

The annual TIE Innovation Technology Exhibition is not only a major annual technology exposure event that attracts global attention, but it also shows top innovation energy, which is bound to drive domestic independent technology and R&D momentum to leap across the world. . The physical exhibition will be on display at World Trade Center Hall 1 from October 13th to 15th, and the online exhibition will continue until October 20th : https://online.inventaipei.com.tw/en/index.html