About Powerchip



Powerchip Technology Corporation was established at Hsinchu Science-based Industrial Park in December, 1994, it provides professional wafer foundry service to major domestic and international semiconductor industry with 4,800 employees and capital NT$22.2 billion dollars.
In the beginning, Powerchip and Japan's Mitsubishi Electric Co. formed the strategic alliance in technology, production and sales; in 2003, Powerchip started to cooperate with Japan's DRAM major manufacturer Elpida Memory Inc. with research, production and sales on the most cutting-edge DRAM products. Besides, Powerchip is also the main partner of Japanese manufacturer Renesas Technology Corp., we manufacture many kinds of logic and memory products with wafer foundry production.

In order to establish the technical autonomy, Powerchip started to individually develop high capacity flash memory (NAND Flash) technology and became the only one enterprise in Greater China possess comprehensive technologies in design, process development and NAND Flash production; the 16Gb MLC flash memory product had been awarded the 2011 excellence award from Ministry of Economic Affairs of Taiwan.

Powerchip 8 inch wafer fab started the operation at Hsinchu Science-based Industrial Park in 1996, and started produce DRAM
product; in 2002, the first 12-inch wafer fab of Powerchip (P1 fab) officially started production, so far Powerchip has three 12-inch fabs with total monthly 100 thousand wafers. In December, 2006, Powerchip and Elpida joint ventured the Rexchip Electronic Corp. in Central Taiwan Science Park. In 2008, Powerchip split the 8-inch fab to be independent Maxchip Electronic Corp. and entered the wafer foundry market; in 2008 August, Powerchip sold shares of Rexchip to American Micron and successfully transit to professional wafer foundry, and became the one among the top 6 in the world.

Powerchip devoted in sophisticated technology and customer service to become a world-class semiconductor company with stable profits. Powerchip has both memory and logic product specific manufacturing strength and actively work in different fields as DRAM, Flash, LCD drive IC, Power Management Chip, CMOS Image Sensor Chip as well as integrated Memory Chip. Besides, it launched the Open Foundry business model, which builds close and flexible cooperation mechanism with client in chip design, manufacturing service, equipment and production capacity sharing according to different characteristics and needs of our clients. In the future, Powerchip will continue to promote international cooperation strategy, apply cutting-edge technology, develop its own technology and steadily expand the market in order to accumulate competitive advantages in the rapidly changing high-tech industry, and become the professional wafer foundry supplier that can create win-win situation for our client.


Powerchip is one of the few professional wafer foundry manufacturers that both have memory and logic technology in the world. Focusing on different needs, Powerchip customized tailored "Open-Foundry" operation mode, and expect to grow together and share profits with our clients, we can become one of the top five wafer foundry manufacturers by robust/steady profitability.


  • 2017

    Jun.Nexchip Semiconductor Co. (Fab N1) commences operation.

  • 2016

    Jun.Commences mass production of 25nm aluminum process, 4Gb DRAM.

  • 2015

    Aug.Licenses 25nm aluminum version DRAM Technology from Micron.
    Oct.Signs a cooperation agreement with Hefei City Construction and Investment Holding (Group) Co., Ltd. and established a joint-venture company, Nexchip Semiconductor Co., based in the Hefei Xinzhan General Pilot Zone.

  • 2014

    Aug.Powerchip commences mass production of 55nm small panel LCD driver IC.
    Oct.Powerchip sells Renesas SP share to Synaptics.

  • 2013

    Jun.DRAM foundry agreement established with Kingston and Successfully transformed into professional foundry company, new business model established.
    Aug.Sells Rexchip shares to Micron, and obtains Micron-Elpida 25nm DRAM license.

  • 2012

    Apr.Powerchip commences mass production of 90nm process, LCD Driver IC. Dec.Receves Activity Stamp of Energy Saviing and Carbon Reduction award. Dec.Exited commodity memory sales, transformed and focus foundry services;listed company transformed into public company.

  • 2011

    Jan.Receves the world's first Standard Memory Chip Product Carbon Footprint (PCF) Validation Certificate. Dec.16Gb NAND Flash awarded 20th Taiwan Excellence Award.

  • 2010

    Dec.Commences mass production of 40nm process ,16Gb Flash.

  • 2009

    Mar.Commences mass production of 4Gb Flash.

  • 2008

    Apr.Fab 8A spun off as Maxchip Electronics Corp. Apr.Powerchip establishes joint venture together with Japan's Renesas and Sharp, named Renesas SP, in order to focus on the LCD Driver market.

  • 2007

    Oct.Powerchip and Elpida's Joint Venture, Rexchip, begins Fab R1 operations.

  • 2006

    Jan.Powerchip signs MOU with Macronix for the purchase of Fab P3. Feb.Powerchip licenses AG-AND Flash Memory Technology from Renesas Technology Corporation. Dec.Signs a cooperation agreement with Elpida and established a joint-venture company, Rexchip Electrical Co., based in the Central Taiwan Science Park.

  • 2005

    Jan.Powerchip receives ISO / TS 16949 Certification. Mar.Fab P2 commences operation.

  • 2004

    Apr.Powerchip begins wafer foundry business in its 12-inch fab. Sep.Powerchip Employee Clinic Opens.

  • 2003

    Oct.Second 12-inch fab (Fab P2) groundbreaking.

  • 2002

    Oct.Powerchip receives OHSAS 18001 (Occupational Health & Safety Assessment Series) certification. Nov.Fab P1 commences mass production.

  • 2001

    May.Powerchip issues its 1st ECB offering, raising US$ 200 million. Sep.The Industrial Bureau of the Ministry of Economic Affairs extends their 12th Outstanding Quality Award to Powerchip.

  • 2000

    Jul.First 12-inch fab (Fab P1) groundbreaking.

  • 1999

    Nov.Powerchip issues its 1st GDR offering, raising US$ 288.9 million.

  • 1998

    Feb.Powerchip publicly lists on Taiwan's GreTai Securities Market. Dec.Powerchip receives ISO 14001 certification.

  • 1997

    Dec.Powerchip receives ISO 9002 Certificate.

  • 1996

    Oct.Fab 8A commences mass production of 0.40μm process, 16Mb DRAM.

  • 1995

    Mar.Eight-inch fab (Fab 8A) groundbreaking.

  • 1994

    Dec.Powerchip Technology Corporation is founded.

Quality Policy

Powerchip Technology Corporation maintains a dynamic and agile approach to meeting market demands and sustainable operations goals. Pursuing world-class quality, technology, delivery and value, Powerchip will satisfy our customers with excellent products, through well-trained employees, a high-efficiency quality system, emphasis on the cooperation of the entire staff, and continuous improvement.

Company organization

Management Team

Chairman: Steve R.L. Chen

B.E., National Chung Hsing University, Taiwan
Minister of Economic Affairs

Founder and CEO: Frank Huang

Ph.D., Mount Sinai School of Medicine, NY
Chairman, Powerchip Group

Deputy CEO: Brian Shieh

Ph.D., Electrical Engineering, University of Cincinnati, Ohio
Chairman, AP Memory Technology Corp.

President: Alex Wang

Ph.D., University of Illinois at Urbana-Champaign,IL
Corporate VP and GM, Memory IC Business Group,
Winbond Electronics Corp.

Senior Vice President: K. T. Tong

M.B.A., Temple University, Philadelphia
Vice President, PowerWorld Capital Management Inc.s

Senior Vice President: Peter Ting

M.B.A., National Cheng-Chi University, Taiwan
President, ThaiLin Semiconductor Corp.

VP of Investor / Public Relations And Spokesman: Eric Tang

M.B.A., National Taiwan University, Taiwan
Vice President, Infopro Corp.

Vice President of Sales: Joe Wu

M.B.A., City University of Seattle, WA
Business AVP, Powerchip Technology Corporation

Vice President of Financial Accounting: Jerry Shao

M.B.A., National Taiwan University, Taiwan
Financial Accounting AVP, Powerchip Technology Corporation

Vice President of Business Development: Milton Hsieh

Master of Business School, National Taiwan University, Taiwan
AVP of New Business Development,Powerchip Technology Corporation

Vice President of Production Management: James Liu

M.S., Industrial Engineering, National Chiao Tung University, Taiwan
AVP of Production Planning, Powerchip Technology Corporation

Vice President of Administration: Peter Chen

B.S., Electrical Engineering, National Taiwan Ocean University, Taiwan
Administration VP, Micron Memory Taiwan

Vice President of Product Technology : Joe Chen

M.S., Electronics Engineering, National Taiwan University, Taiwan
President, Zentel Electronics Corp.

Q & A

Company Product and Technology

1. What is main production process technology of Powerchip's logic process wafer foundry?

Powerchip provides different kinds logic technology processes. After years of working, it has accomplished processes for the LCD Driver IC, Image Sensor IC, Power Management IC and Integrated Memory Chip.
  • LCD Driver IC (DDI) for high voltage process technology, we provide 110nm and 90nm DDI process for small and medium panel driver IC, 55nm DDI process has entered to mass production in the second half of 2014 for high resolution DDI products.
  • CMOS Image Sensor (CIS), 110nm CIS process technology is under production for high resolution CIS chips for clients. Powerchip also developed CIS color filter and micro lens process in order to provide clients a more completed CIS wafer foundry service at the same fab.
  • Power Management IC, Powerchip uses 180nm process technology to produce Power management ICs. Powerchip is one of the few manufacturers that provide BiCMOS process foundry at 12-inch fab.
  • Integrated Memory Chip (IMC) which the industry also refers to as embedded memory or embedded Flash technologies Powerchip initially entered the consumer electronic MCU market. In the future, Powerchip will enter related fields such as Near Field Communication (NFC) Control IC, Touch Control IC and Automobile IC, etc.

2. What advantages does Powerchip's memory wafer foundry hold?

Powerchip has provided unique memory foundry for many years and is the only one vendor that can provide 12-inch advanced DRAM memory technologies for foundry service. Continuing the mass production of 40nm DRAM foundry, we can now more actively assist clients to design products by 30nm and 20nm DRAM foundry processes which provide clients better cost structure.
Following the Internet of Things or occurrence of all kinds of mobile application products, standard memory can hardly satisfy all requirements of memory on different applications. Powerchip provides memory foundry service for clients to design different customized memory products that target at different markets, and thus satisfy our clients' best memory cost-performance ratio (CP value) requirements.

Powerchip can provide clients DRAM design service for customized DRAM which satisfies greater system bandwidth requirements. Powerchip can also assist on integrating logic and memory for 3D IC, thus can generate a stronger system computing performance. print

3. What is Powerchip NAND Flash technology's main application?

Powerchip NAND Flash production process technology's product

application can be divided into:

  • MLC (multi-level cell) Flash Chip: used in small memory cards, MP3 music players, and USB discs. The production technology has advanced to 40nm process, with again, 20 nm process has entered its development phase.
  • SLC (single-level cell) Flash chip: Targeting the mobile application devices, internet of Things and the industrial application market, Powerchip provides low-power, energy saving and high-reliability SLC Flash chips. The 40nm SLC Flash process can provide 1 bit ECC feature, also provide the option of low voltage, and perform with high reliability.

4. What is an Open Foundry Business Model?

Besides providing its own full range wafer foundry technologies, Powerchip utilizes its accumulated wafer manufacturing know-how and experiences to develop its own specific Open Foundry cooperation model, we can provide differential cooperation models pertaining to design service, testing, process technology, machine or wafer manufacturing administration, and leverage the advantage of 12-inch wafer capacity to enhance clients' cost competitiveness.

Open Foundry Models


5. What is Powerchip's current production capacity status?

Powerchip already has three 12-inch wafer fabs (P1/P2/P3 fabs) in the Hsinchu Science-Based Industrial Park with a maximum total monthly production capacity of approximately 100 thousand wafers.

Item Fab P1/P2 Fab P3
Fab 12-inch Wafer Fab 12-inch Wafer Fab
Full Monthly Production Capacity 80,000 wafers 20,000 wafers

Our Location

Corporate Headquarters / Fab P1 / Fab P2
No. 12, Li-Hsin 1st Rd. Hsinchu Science Park, Hsinchu. Taiwan, R.O.C.
Tel: 886-3-5795000
Fax: 886-3-5788565

Fab P3
No. 16-1 Li-Hsin Rd. Hsinchu Science Park, Hsinchu, Taiwan, R.O.C.
Tel: 886-3-5791000
Fax: 886-3-5632345

By bus

If you come to Powerchip by U-bus or YaLan-bus, getting off the bus and transferring to the Green-line shuttle bus at the Science Life Building Stop to arrive at Powerchip.

By train

When you arrive at the Hsinchu station, you can take bus(on the Min-Zu road in front of the Sogo Department Store) No.1, No.30, No.31 to Science Park. Getting off the bus at Science Park Main Entrance Stop and you will arrive at Powerchip by transferring to a taxi or Green-line shuttle bus.

By car

Zhong-shan freeway

South; Go through (Guang-Fu) intersection to ZhuDong, after you arrive at the first overpass. On the right hand side is the entrance to the Hsinchu Science Park, as you arrive at the entrance of the Science Park. Keep going straight and follow the sign. From Science Park go straight, turn right when you meet Li-Hsin 6th road. Turn left when you meet Li-Hsin 1th road, you will find that Powerchip on your right side in about one minute.
North; Go through Science Park Intersection, and then turn right to Park 2nd Road. Go straight to Pao-Shan Road, and then turn left to Li-Hsin 3rd Road. Turn left to Li-Hsin 1st Road, you will see Powerchip on your left hand side.

Second freeway

Go through Zhu-Lin intersection, from ZhuDong to Hsinchu city center is about thirty minutes. When you see the Hotel Royal turn left, you will see the entrance to the Science Park. Go straight to Li-Hsin 6th road as you meet Li-Hsin 1st road then turn left. You will see Powerchip on your right side in about one minute.
Upon arriving at Powerchip, please follow the instruction and find a parking space for yourself.